Igniting the Spark

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• Charging interfaces: Ensure compliance with SAE, ISO, and regional standards while also considering thermal management and mechanical durability. Future outlook: Innovation opportunities for engineering teams As vehicle designs evolve, so do the challenges and op- portunities for connector design. Areas for exploration and collaboration include: • Integration of smart features: Embedded tem- perature sensors or memory chips in connectors can enable condition monitoring and predictive maintenance. • Design automation: ECAD/MCAD connector librar- ies and simulation tools accelerate placement, validation, and harness routing. • Additive manufacturing and prototyping: 3D-print- ed custom interconnects or enclosures are valuable for early validation and testing. • Flexible and optical interconnects: Developments in fiber-optic and high-speed flexible printed circuits (FPCs) for electric vehicle (EV) and infotainment architectures can improve design. For design engineers shaping the next generation of electric and connected vehicles, connector selection is not a secondary decision — it is foundational. The performance, reliability, and manufacturability of nearly every subsystem depend on choosing the right inter- connect solutions. By balancing electrical, mechanical, thermal, and en- vironmental requirements early in the design cycle, engineers can make direct contributions to vehicle safety, efficiency, serviceability, and sustainability. Whether specifying a high-voltage busbar or a minia- ture high-speed signal connector, the decisions made at the design table have a ripple effect across the entire vehicle lifecycle. Connect with I-PEX to learn more.

I-PEX EVAFLEX 5-SE-G VT

Applications across the vehicle: Key considerations for design engineers Design engineers encounter unique connector require- ments depending on the system. • Battery and power systems: Focus on current rating, thermal rise, creepage distances, and short-circuit survivability. • Data communication: Prioritize impedance control, EMI shielding, and support for next-gen protocols like 10BASE-T1S. • Sensing and control: Use miniature connectors with reliable latching and mechanical strain relief; validate IP rating for exterior sensors. • Infotainment and connectivity: Minimize connec- tor profile height while maintaining shielding for wireless modules. • Interior comfort: Select flexible interconnects that are compatible with dynamic motion (e.g., seats, doors) and can withstand cyclic stress.

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