GROWTH IN 5G SPURS INCREASED DEMAND FOR LOW PIM ASSEMBLIES HOW TO ENSURE LOW PIM RF INTERCONNECTS ARE MAXIMIZING NETWORK PERFORMANCE
KEVIN MOYHER, PRODUCT MANAGER FOR COMMERCIAL PRODUCTS TIMES MICROWAVE SYSTEMS
limits receive sensitivity, lowering the cellular system’s reliability, data rate, and capacity— counterproductive to the promise of 5G. WHAT CAUSES PIM? Connectors, cables, and termination quality all have the potential to play a role in PIM. Performance degradation may occur as a result of the non-linear junction of components and materials, or in other words, in junctions where the current does not increase linearly with voltage. To minimize PIM, ensure connectors are properly and securely tightened and choose suitable materials and platings to help reduce potential PIM issues. Eliminate non-linear contacts within the RF interconnect and poor electrical contacts. PIM issues can also occur as a result of loose parts, ferrous materials, parts with rough surfaces, residual flux, oxidation, etc. If conductive material is used, particulates on the
5G is currently the fastest growing segment of the wireless infrastructure market. 5G small cell and DAS systems will play a critical role as the telecom industry increasingly builds 5G infrastructure, substantially increasing demand for RF interconnect solutions that accommodate essential connections in smaller, more compact installations while minimizing passive intermodulation (PIM) effects. PIM is the result of a distortion generated by two or more high-power signals that interact with non-linear characteristics in the RF path. When multiple high-power frequencies occur on the same RF interconnect, additional frequencies may form and raise the noise floor. PIM is an issue for a multitude of wireless systems, but it is more noticeable in cellular applications such as 5G because its high frequency bands are very close to each other. The resulting PIM effects can create interference that
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