Smart Connectivity, Connected Infrastructure, & the…

LOW PIM ASSEMBLY TESTING Testing RF assemblies for PIM as a type of quality measurement is also a critical step in the process. Reputable manufacturers will perform both static and dynamic testing on all RF interconnects. A standard test is to place two 20-watt signals on the RF interconnect to look at the third-order harmonic, typically the harmonic of the largest magnitude. Most testing requirements are looking for -153 dBc or better. There are two types of tests. The first is a static bench test that is performed with no movement of the cable. This is a relatively easy test if the proper materials and platings are used and all threaded connections are appropriately tightened. The second is a dynamic test, where the connectors are tapped to detect any conductive particles within the interface, and the cable is flexed or side- loaded behind each connector. The dynamic test is a much higher bar to meet. The flexing of the cable will transmit a force to the electrical transition between the cable and the connectors and detect any non-linear contact within the shift.

Dynamic IEC- recommended tests to ensure jumpers meet or exceed PIM standards. For traceability purposes, test results should be made available in an easily accessible location or even individually barcoded on each cable for easy reference. testing should replicate As 5G networks become the telecommunications infrastructure of choice, new system designs that accommodate higher frequencies will be required. One of the critical considerations in 5G network design should be the use of low PIM RF interconnects to help maximize performance. There are a variety of innovative options emerging to meet these needs. Ensure that any RF assembly ultimately chosen meets the optimal materials considerations for each unique project, and that the products have undergone thorough testing by a reputable manufacturer with easy to find results.

To learn more, visit Times Microwave Systems.


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