High Speed with Signal Integrity eBook

8. DE-EMBEDDING The effect of PCB fixtures must be removed from measurement results using de-embedding. It is recommended to implement the IEEE 370-2020 standard to ensure an optimal PCB manufacturing and de-embedding process. 9. SERDES SIMULATION The overall speed of a communication system on the physical layer depends on the physical layer’s architecture and the specifications of the

6. GEOMETRICAL OPTIMIZATION Any geometrical entities can potentially improve or disturb the flow of energy from one side of a connector to the other side. Hence, every high- speed related design must be cross-optimized for all aspects of mechanical, electrical, signal- integrity, and EMI/EMC performances. The main influential parameters to consider are connector design, cable length, cable performance (loss), and the controlled and repeatable cable assembly and potting processes above 1 Gb/s.

The Fischer MiniMax™ Series with nine contacts is an example of a connector that has been specifically designed to achieve high-speed data transfer using a single protocol (USB 3.2).

transmitter and receiver. In many applications a special configuration of a communication link may deviate from specifications in the standards. System-level serializer/deserializer SerDes) simulations are used to measure the data transmission rate of a cable-connector assembly. The simulations can be visually represented in an eye diagram, in which a superimposition of bits create an “eye” shape that provides insight into the system and crucial connection parameters at a glance. The diagram shows whether signal transmission is taking place at the required speed and how susceptible is it to interference.

7. IMPEDANCE MEASUREMENT After ensuring mastery of the transverse electromagnetic (TEM) mode of propagation by observing the longitudinal field distribution, it is essential to make sure that pin diameters and their distributions are designed properly to achieve the right impedance. The design of a connector can affect NEXT and FEXT performances, and the connector must be optimized against these constraints as well. For impedance measurement, one can use a time domain reflectometry (TDR) device.

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