MAINTAINING SIGNAL INTEGRITY IN THE ERA OF SWAP TRAVIS NEUMANN, SPECIAL PROJECT MANAGER, OMNETICS CONNECTOR CORPORATION
SWaP (Size, Weight, and Power) is a major challenge for designers tasked with the development of modern-day electrical and computer equipment. A shift from analog to digital electronics has brought new and improved capabilities in smaller package sizes. What once required a computer, camera, fax machine, and phone can now be done on a single device. To accomplish this pairing down of size and components, more electronic signals now fit into a reduced form factor. New chip and board materials have lowered operating voltages and current demands, thereby increasing battery life for portable devices. Those same processes and materials also brought a better understanding of impedance, and how something as seemingly simple as wire spacing inside a board or cable can have a dramatic effect on the quality of signals, especially those running at high speeds. Additionally, to combat attenuation, connectors developed in the past two decades are able to push data and power using flat pins. Flat conductors have less field effect on neighboring conductors, improving signal integrity and performance. Follow that up with appropriate shielding around the exterior through use of conductive foil wrap or braid and it creates a compact solution that maintains performance across a wide array of environments.
From field radios to portable surveillance systems, each device is responsible for distributing power and signals accordingly. These devices include GPS and night-vision aids, as well as Wi-Fi hotspots capable of transmitting real-time battlefield intelligence in some of the harshest environments on the planet. Equipment used in the field has many specific considerations such as damage resistance and environmental factors, and signal requirements are primary during the design process. Users want small lightweight solutions that deliver in these tough environments, and it is necessary to examine how these variables will affect size, weight, and power. SIZE The size of connectors can be determined from customer preference, use case, or both. Connectors based on MIL-DTL-83513 and MIL- DTL-32139 specifications can be customized to different form factors which meet specialized requirements. Options exist to reduce the overall size of the connector, with one great option being hybrids. Hybrid connectors utilize several large contacts for power delivery with smaller contacts to carry signal and come in any number of form factors.
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