into the following steps: 1. After the FEA insertion and extraction simulation, the connector’s insertion and extraction force data can be obtained, to judge whether the mechanism design meets the requirements. Furthermore, the deformation state of the terminal can be derived from the simulation results of FEA after the connector is inserted. After multiple verification simulations, as long as the material parameters and FEA simulation conditions are set correctly, the insertion force and state of deformation of the terminals accurately provide results very close to the actual values.
frequency simulation. 3. After the continuous and repeated adjustment of design and simulation, S-parameters that meet the needs of customers can be obtained. The four high-frequency conditions are characteristic impedance, insertion loss, return loss, and near-end and far-end crosstalk (NEXT and FEXT). The signal integrity problems that arise with higher transmission frequencies and the design challenges for the connector become even more severe. In theory, with regard to high frequency transmission, the more matched the characteristic impedance, the less occurrence of signal integrity problems. However, under the limitation of the space mechanism, the shape of the connector’s contact terminal will be more irregular, resulting from the connector being matched to the high frequency transmission. Characteristic impedance is difficult, especially as the design of PCB layout has a great impact on signal integrity. Therefore, in the development of customized high-speed connectors, a more accurate reference can be obtained by means of FEA simulation to ensure signal integrity, meet the high-speed transmission requirements of the equipment, and effectively avoid the waste of resources which therefore results in cost savings.
Greenconn obtains near-actual insertion force data and the state of terminal strain through multiple high-speed connector FEA insertion and extraction simulations.
2. Add the terminal deformation state found by the FEA simulation and redraw the 3D model of the PCB. Import the drawn model into the high-frequency FEA software and set the parameters of the model to perform the high-
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