the maximum data rate; to find the data rate it would support, it is multiplied by two. Based on this methodology the KVPX connector, which does not reach -3 db until after 8 GHz, is able to support high-speed signals of data rates up to 16 Gb/s. Smiths Interconnect’s KVPX Series is a shielded, high- density, high-speed, modular interconnect system optimized for differential pair architectures on a 1.8 mm x 1.35 mm grid. The backplane modules are available in 8 and 16 row increments on a 1.8 mm x 1.8 mm grid, with user-configurable keying and integrated stainless steel guide pin/keys. The KVPX Series was designed to complement the product offering for the VPX market. It serves data-intensive applications where high throughput and high computes are the critical factors: intelligence, surveillance and reconnaissance (ISR), signals intelligence (SIGINT), radar applications, and electronic counter measures (ECM).
Satellite manufacturers often use large singular printed circuit boards featuring very high value components. Selecting a solderless PCB mount design allows the connector to be placed and replaced with very low risk to the board, reducing the cost of ownership. The connector is mounted after reflow and has no impact on nearby components. Each product is engineered using 3D electromagnetic simulation (EM) software to provide excellent performance in a total thin film process. A common practice in the industry is to rate connectors based on insertion loss; the frequency where the connector’s insertion loss reaches -3db is accepted as a threshold, since at -3db, half of the power is lost in the connector. This frequency is referred to as the first harmonic frequency of Smiths Interconnect’s NXS Series is an advanced high- speed, high-density interconnect equipped with the proven Hypertac hyperboloid contact technology to withstand data rate application requirements up to 10 Gb/s (per channel), including extreme levels of vibration, shock, and climatic testing above 2100 G. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. This ultra-high contact density and compact form factor enables a 90˚ transition within a very small footprint. It is blind mateable, hot pluggable, with ultra- low mating forces and low outgassing materials.
Smiths Interconnect’s Hypertac hyperboloid contact technology is designed for use in demanding environments where reliability and safety are critical. The shape of the contact sleeve is formed by hyperbolically arranged contact wires, which align themselves elastically as contact lines around the pin, providing a number of linear contact paths.
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