With this type of board-to-board connector, an installed height of two male and two female connector strips with PCB spacing of 6 to 12 mm can be implemented. In the future, this type of system will accommodate larger PCB spacing values and provide greater design flexibility. With a large locking range of ±0.7 mm and a slope tolerance of up to 4 degrees, the insulation housings can enable convenient and reliable connection even in rugged applications. This also ensures tolerance compensation of ± 0.3 mm when mated. On the one hand, this makes it possible to compensate for production tolerances during assembly and soldering of surface mount devices (SMD). On the other hand, the large tolerance compensation makes it possible to place several of these connectors on the same PCB. This is not possible with conventional board-to-board connectors. EQUIPPED FOR THE FUTURE The connectors are suitable for both data and signal transmission. Each contact can handle a current of up to 1.7 A, and the connector can achieve data transmission speeds of up to 16 Gb/s. This means that the system can also handle future requirements.
the case of high-speed data transmission. A value of 50 ohms is typical for single-ended signals, and 100 ohms is typical for differential applications. To minimize interference, shielded connectors are a wise option. In addition to vertical connectors for mezzanine PCB arrangements, horizontal versions are available for orthogonal and coplanar PCB connections with 12 to 80 contacts per connector (Figure 4).
When selecting connectors for an industrial application, speed and ambient conditions are important factors. If the application requires high-speed data transmission, this new type of board-to-board connector is ideal, as they provide high-speed data delivery, mechanical robustness, and optional shielding, as well as a slimmed-down form factor that meets many requirement profiles. Figure 4: The board-to-board connectors in the FP 0.8 series allow for a flexible PCB arrangement – shielded and unshielded versions with 12 to 80 contacts follow the trend for the miniaturization of electronic modules.
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